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Join date: Aug 25, 2018
Posts (17)
Sep 13, 2024 ∙ 4 min
Deaeration System for Void Prevention in Desmear Process of Build-up Wiring for Advanced Semiconductor Packaging! "Livalley" 【Degassing System Application Techniques】
Hello, this is TZ from the Sales Department. In advanced semiconductor packaging processes, ensuring the reliability of build-up wiring...
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Jul 20, 2024 ∙ 3 min
Magnetic film electroplating technology used for magnetic sensor applications
Hello, this is TZ from the Sales Department. Our plating technology started with magnetic film plating, which is our specialty. Recently,...
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Jul 8, 2024 ∙ 3 min
Indium Bump Plating - Discussion on Microbumps Using Low-Melting Point Solder Materials
Hello, this is TZ from the Sales Department. We have recently received an order from a domestic sensor manufacturer for a 300mm face-up...
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