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Electroplating stations
Product Line-up
We not only have the following four types of plating equipment, but also own multiple plating equipment for R & D and prototype testing. We can propose the equipment according to the application such as R&D of the plating process, trial production of new products, and small-quantity production.
・ A wide range of electroplating equipment options
・ Customization to meet the process requirement
・ Compatible with various wafer size from 4 to 12 inches
・ Face-up, Face-down, Vertical dip, Rise-up
・ Fully automatic, semi-automatic, manual, desktop type
About Tosetz's plating tool
Regardless of the chemical solution, we can propose the type of plating equipment and process according to the customer's purpose.Most of the ordered equipment has original specifications, and we can provide the equipment to satisfy your requirement.
4 types
Plating method
Support both plating methods and processes to achieve the purposes.
Uniformity
within ±2%
Face-up type
All composition of magnetic layer plating are available
Support various type of electrolyte recipes and thin-film depositions
Optimized solutions
Proposal of original tool specification to achieve customer's purpose.
Delivered to all companies in
HDD industry
Magnetic plating tool
4 types of plating methods and process support depend on the purpose
We can propose four types of plating methods according to the customer's purpose, and our process engineers also provide process support. Click here for an overview of process support.
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Application
Item
Structure
Feature
Materials
Wafer size
Face-up
Face-down (Cup)
Vertical Dip
Rise-up
Excellent Thickness Uniformity
Good Alloy Uniformity
Unti-corrosion systerm
Cassette to Cassette
Small footprint
Cassette to Cassette
Small footprint
Square board, Large board
No need to protect the back side
Cassette to Cassette
Magnetic alloy, Cu, Ni etc.
Cu、Ni、Au etc.
Cu、Ni、Au etc.
Electro-less、CoWB、Cu、Ni、Au、Pd etc.
Wafer（4", 6", 8", 12"）
Wafer（4", 6", 8", 12"）
Wafer（4", 6", 8", 12"）
Square substrate(Rigid, Flexible)
Wafer（4", 6", 8", 12"）
Electro-Plating
Electro-less-Plating
Magnetic film plating for all compositions
■We can propose a magnetic film according to the device applications (characteristics and composition)
(Example: Soft magnetic film for magnetic sensor, high Bs film for HDD magnetic head etc.)
■We can prepare and form a plating solution for the entire composition of Ni, Fe, and Co binary and ternary alloys.
■P, Mo, Pd, etc. can be alloyed.
■You can consult with us about the evaluation method of magnetic characteristics, management method on mass productions, etc.
Track record of delivering magnetic film plating equipment to
all companies in the HDD industry.
In recent years, our unique technology cultivated in the field of magnetic materials for HDDs are widely used for the plating process in manufacturing of small electronic components, semiconductor and MEMS installed in mobile devices such as smartphones and tablets, etc.
Low-power
Parasitic
Magnetic Sensor
Sensor
Module
LED
SiC, GaN, Next G. Power Device
HDD
CPU
Memory
Communication Device
Edge Computing
SAW Filter
MEMS
OLED
Use of many plating tools is expected in the field of following new technologies
Business Model of Tosetz's Plating Tool Proposal
We can dispatch our process engineers to support the start-up of the plating tool and processes ordered by the customer. Of course, we can also provide experiments and experimental data.
STAGE
04
Equipment / process startup
STAGE
03
We make a final proposal for plating tool based on the content of hearings from customers.
We carry out the most efficient and cost-effective price proposals including process support if necessary.
Proposal of plating tool specifications
Specification requirement confirmation
After receiving inquiries from customers, we confirm the specifications and requirements. Based on the information, we propose targeted plating and other conditions (plating method, preparation and selection of plating solution, etc.)
STAGE
01
Demonstration experiment / feedback of the results
STAGE
02
We install demonstration tool, conduct experiments with wafers provided by customers, and feedback the results to the customer.
