Tosetz system is not just a Gas abatement system. It's a Wet and Powder removal system
Panacea & EX Series
Gas abatement system

Product Line-up
Tosetz Panacea series are designed for abatement of toxic effluent exhaust gases and for removal powder from Semiconductor and LCD production tools such as CVD, Dry etcher.
Tosetz has strengths in big-flow rate scrubbers installed indoors and clean rooms.
Panacea Series


Tosetz main product, High abatement efficiency
with microbubble and High up-time.
Plentiful supply record for gas abatement
and Powder removal(By-products).
■ Process tools
・ Dry etcher、CVD、Epitaxial growth system
■ Abated gas
・ Cl2, HF, HCl, CVD burned exhaust gas
・ Powder removal (By-products)
■ Gas flow rate
・ Max.:~4000L/min
Ex Series



Conventional shower and bubbling type
Suitable for abatement of small~big gas flow rate
NaOH dosing type
■ Process tools
・ Wet etching tool、CVD、Wet cleaning tool
・ Epitaxial growth system、Vent gas for cylinder
cabinet
■ Abated gas
・ Cl2, HF, HCl, HNO3,NH4
・ CVD burned exhaust gas, Organic/inorganic gas
■ Gas flow rate
・ Max.:~60m3/min
Panacea Series
Micro-bubble Wet Scrubber


Reduce cancer-causing substances
99% or more of Cl2 removed only with water
Improve yield of manufacturing process
Plentiful supply record for LCD Fab
■ Process tools
・ Dry etcher、CVD、Epitaxial growth system
■ Abated gas
・ Cl2, HF, HCl, CVD burned exhaust gas
・ Powder removal (By-products)
■ Gas flow rate
・ Max.:~4000L/min
■ Feature
・ Halogen-based gases such as Cl2, F2 exhausted from
dry etcher are abated 99.7% or more only with water
・ Achieve 99% or more removal of the powder,
by-products (2.5 um) generated from dry etcher
・ Big reduction of running cost by using recycle water
and not using chemicals
・ Efficient removal of powder in the latter stage of burner
for CVD and Epi tools
・ Reduce cancer-causing substances proceeded from burner
・ Big reduction of down time of manufacturing tools
by improving maintenance cycle of burner
Ex Series
Bubbling & Spray type Scrubber



Supply records of 1000 or more
in Japan and overseas.
Big-flow rate scrubbers installed
indoors and clean rooms.
■ Process tools
・ Wet etching tool、CVD、Wet cleaning tool
・ Epitaxial growth system、Vent gas for cylinder cabinet
■ Abated gas
・ Cl2, HF, HCl, HNO3, NH4
・ CVD burned exhaust gas, Organic/inorganic gas
■ Gas flow rate
・ Max.:~60m3/min
■ Feature
・ Plentiful supply records and stable operation
・ Supply records of 1000 or more in Japan and overseas
・ Big-flow rate scrubbers installed indoors and clan rooms
・ Use an anti-corrosion fan. Seal and anti-corrosion measure
on fan impeller
・ Use SUS for organic gas and PVC for inorganic gas

Combination of other abatement system
Example:Combination with PFC cracking systems such as Plasma system,
Burn systemCatalyst system, PFC gas recovery system
Panacea & EX Combined Type
Micro-bubble & Spray type Wet Scrubber
Model No.:P-200V-HA-M2
Max. flow rate : 200L/min
Yield improvement of
Mass production system
Plentiful supply record
for LCD industry in Asia

High abatement performance
by micro bubble
Abatement efficiency
Cl2 >99%, SiF4 >99%
液晶工場・半導体工場向けドライエッチング装置用 湿式除害装置
ドライエッチング装置~PFC燃焼除害装置の間に設置します。

特長1:
Fluorine gas is abated with Panacea, and chlorine gas is abated with the NaOH scrubber.
The reaction products and fluorine gas generated in the dry etching process are treated with Panacea,
and the chlorine gas is treated with NaOH scrubber in the 2nd stage.
特長2:
Reduce cancer-causing substances proceeded from burner.
By abating fluorine gas and chlorine gas separately, the generation of by-products in the abatement system is suppressed,
and by abating chlorine gas with NaOH scrubber, Dioxin is generated in burner is reduced.
特長3:
Yield improvement of mass production and Big reduction of burner PM costPanacea can realize the yield improvement of mass production and big reduction of burner PM cost.
