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Indium Bump Plating - Discussion on Microbumps Using Low-Melting Point Solder Materials
Hello, this is TZ from the Sales Department. We have recently received an order from a domestic sensor manufacturer for a 300mm face-up...
Jul 8, 20243 min read
"Solder plating" required for advanced mounting of electronic devices in the future
Hello! I'm TR of R&D department. In this article, I’d like to explain about our solder forming process by electroplating in order to cope...
Jun 19, 20223 min read
The Story of low coefficient of thermal expansion (CTE) copper plating technology development
Hello! I'm TR of R&D department. In this article, I would like to talk about the technological development of copper plating solution...
Jun 18, 20223 min read
Electrode formation technologies for power device products, semiconductor lasers, and optical communication device substrates.
Hello! I'm TZ of sales department. The power semiconductor market is currently expanding in response to energy conservation due to tight...
Jun 18, 20225 min read
Low thermal expansion Invar plating / electroforming technology development
Hello! I'm TR of R&D department. In this article, I’d like to explain about our development of NiFe alloy plating / electroforming...
Jun 5, 20223 min read
Electroforming process technology development by low stress nickel plating
Hello! I'm TR of R&D department. In this article, we would like to talk about the development of our low-stress nickel plating technology...
Jun 5, 20223 min read
Plating technology development that contributes to the through silicon vias (TSV) process.
Hello! I'm TR of R&D department. In this article, We would like to talk about the development of our plating technology that realizes the...
May 15, 20223 min read
Significant points in pretreatment and posttreatment of the plating process
Hello! I'm TR of R&D department. In this article, I would like to talk about our attempt for the pretreatment, posttreatment, which are...
May 15, 20223 min read
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